Company Description Description We're moving!
HENNGE is tentatively scheduled to relocate our Tokyo headquarters from Shibuya to Shinjuku in April 2027. All the batches opened for application will take place at our brand-new Shinjuku office.
Official press release (in Japanese): https://hennge.com/jp/info/news/20241213_move
- Begin the application process
Click here to register for the coding challenge (no time limit):
https://challenge.hennge.com/?entry-code\=GIP-ITB
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About the Program
HENNGE’s Global Internship Program (GIP) is an on-site software engineering training program designed and run by HENNGE, a cloud security company based in Tokyo. The program is created for students and early-career engineers who want to strengthen their full-stack engineering skills in a global, English-speaking environment at our Tokyo headquarters.
This Full-Stack Pathway focuses on hands-on application development training across back-end, front-end, and basic DevOps, using Python (non-ML stack), Go, or TypeScript on the back-end and TypeScript with modern front-end frameworks on the front-end. The program emphasizes fundamental engineering skills, problem-solving, explanation, and collaboration, rather than production work.
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What You’ll Learn \& Practice
During the program, you will:
Program Structure
Internship schedule
Can’t find a batch that fits your schedule? Sign up for our newsletter to stay updated on future batches: https://83aa0c2c.sibforms.com/serve/MUIFAG5FB71Mjhl2I6yLJoSdFdVIN6g78CRvB4lU-JEyLiGnqFM8fFopWxzKw19HtOVKuJbBr-g7fb-iBUvOzXmCfzY8rwbWiX5kSoAS2gQIwhCNx3nT9GCx5u2gzzzchnMjWduSg8VeNi2TXWnJnUEDQEurM68plEnbJa3iizCP-6BdN_f-f4nL2wC1jXPMKum54dmzr5vhYnAY8Q\=\=
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Benefits
**This internship is an unpaid training program with a subsidy provided to all interns
Requirement Essential Qualifications
At least meet three of the following:
More details about the technology stack for this internship program:
https://stackshare.io/hennge/hennge-global-internship-program
Our Ideal Candidate
Our ideal full stack engineering intern is a curious problem-solver who’s excited to build real-world applications and grow in a fast-paced tech environment. We’re especially interested in candidates who:
Bring your curiosity, versatility, and drive – we’re excited to see what you can build with us.
Job Responsibilities Other Information How to apply
Register through the apply button below and verify your email address.
Solve the coding challenge and submit your work with your CV and cover letter.
An HR interview, followed by a final interview, will be given to those who pass Step 2.
Before you apply: Your CV and cover letter are your chance to show us your story. Clear, thoughtful explanations of your experiences will make your application stronger, while generic submissions may not fully reflect your potential.
We suggest reviewing this guide to help you present your best self:
https://hennge.com/global/info/henka/interview/202403-crafting-the-perfect-cover-letter/
Our Stance on AI and Software Engineering
AI tools can be helpful, but the goal of HENNGE’s Global Internship Program (GIP) is to help you build strong software engineering fundamentals.
To support that learning, we ask you not to use AI tools to generate code for training assignments or solution implementations. The code you submit should be written by you and reflect your own understanding.
You may use a designated AI service to support your learning in non-code-generating ways, such as clarifying technical concepts, understanding documentation, or helping with non-essential tasks (for example, command-line options).
Throughout the program, you’ll be expected to take ownership of your code and clearly explain your thinking, trade-offs, and design decisions. In this learning environment, you are the engineer and the final gatekeeper of quality.
Notice for Applicants
Begin the application process
Click here to register for the coding challenge (no time limit):
https://challenge.hennge.com/?entry-code\=GIP-ITB
Only shortlisted candidates will be contacted.
Job Location \<p>Tokyo, Japan\</p> Deadline 01 February 2027 Quota 0 Applicants 1